Saltar al contenido principal
Elsevier

Advances in Heat Transfer

  • 1 Edición, Volumen 55 - 25 de mayo de 2023
  • Última edición
  • Editores: John Patrick Abraham, John M. Gorman, Wolodymyr J. Minkowycz
  • Idioma: Inglés

Advances in Heat Transfer, Volume 55, the newest release in this series, highlights advances in the field with this new volume presenting interesting chapters written by an intern… Leer más

Descripción

Advances in Heat Transfer, Volume 55, the newest release in this series, highlights advances in the field with this new volume presenting interesting chapters written by an international board of authors. Topics discussed in this release include Mesoscopic Scale Simulations of Heat Transport in Porous Structures, Advancements in Single-Phase Enhanced Heat Transfer in Microchannels, and more.

Puntos claves

  • Provides the authority and expertise of leading contributors from an international board of authors
  • Presents the latest release in the Advances in Heat Transfer series

De interès para

Industry practitioners and academics teaching advanced courses

Índice

1. Huan Guo

2. Li He

3. Suvanjan Bhattacharya

4. Mesoscopic Scale Simulations of Heat Transport in Porous Structures
Yan Su

5. Tengfei Luo

6. Advancements in Single-Phase Enhanced Heat Transfer in Microchannels
Srinath Ekkad and Prashant Singh

7. Tie Wei

Detalles del producto

  • Edición: 1
  • Última edición
  • Volumen: 55
  • Publicado: 26 de mayo de 2023
  • Idioma: Inglés

Sobre los editores

JA

John Patrick Abraham

John Abraham is at University of St. Thomas, Saint Paul, MN, USA
Afiliaciones y experiencia
University of St. Thomas, Saint Paul, MN, USA

JG

John M. Gorman

John Gorman is at University of Minnesota, Minneapolis, MN, USA
Afiliaciones y experiencia
University of Minnesota, Minneapolis, MN, USA

WM

Wolodymyr J. Minkowycz

Wolodymyr J. Minkowycz is the James P. Hartnett professor of mechanical engineering at the University of Illinois at Chicago. He has performed seminal research in several branches of heat transfer and has published about 175 papers in archival journals. He is also editor-in-chief of the International Journal of Heat and Mass Transfer and the founding editor of Numerical Heat Transfer.
Afiliaciones y experiencia
Professor of Mechanical Engineering, Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, USA

Ver libro en ScienceDirect

Lee Advances in Heat Transfer en ScienceDirect