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Elsevier

Advances in Heat Transfer

  • 1 Edición, Volumen 56 - 13 de septiembre de 2023
  • Última edición
  • Editores: John Patrick Abraham, John M. Gorman, Wolodymyr J. Minkowycz
  • Idioma: Inglés

Advances in Heat Transfer, Volume 56, presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters writte… Leer más

Descripción

Advances in Heat Transfer, Volume 56, presents the latest in a serial that highlights new advances in the field, with this updated volume presenting interesting chapters written by an international board of authors.

Puntos claves

  • Provides the authority and expertise of leading contributors from an international board of authors
  • Presents the latest release in Advances in Heat Transfer serials

De interès para

Industry practitioners and academics teaching advanced courses

Índice

1. Raj Manglik and Sandra Boetcher

2. Akira Nakayama

3. Nenad Miljkovic

4. Yurong He

5. Beomjing Kwon

6. Rasool Kalbasi

7. Bidyut Baran Saha

8. Bing-Yang Cau

Detalles del producto

  • Edición: 1
  • Última edición
  • Volumen: 56
  • Publicado: 14 de septiembre de 2023
  • Idioma: Inglés

Sobre los editores

JA

John Patrick Abraham

John Abraham is at University of St. Thomas, Saint Paul, MN, USA
Afiliaciones y experiencia
University of St. Thomas, Saint Paul, MN, USA

JG

John M. Gorman

John Gorman is at University of Minnesota, Minneapolis, MN, USA
Afiliaciones y experiencia
University of Minnesota, Minneapolis, MN, USA

WM

Wolodymyr J. Minkowycz

Wolodymyr J. Minkowycz is the James P. Hartnett professor of mechanical engineering at the University of Illinois at Chicago. He has performed seminal research in several branches of heat transfer and has published about 175 papers in archival journals. He is also editor-in-chief of the International Journal of Heat and Mass Transfer and the founding editor of Numerical Heat Transfer.
Afiliaciones y experiencia
Professor of Mechanical Engineering, Department of Mechanical and Industrial Engineering, University of Illinois, Chicago, USA

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