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Elsevier

Encapsulation Technologies for Electronic Applications

  • 2 Edición - 11 de octubre de 2018
  • Última edición
  • Autores: Haleh Ardebili, Jiawei Zhang, Michael G. Pecht
  • Idioma: Inglés

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary e… Leer más

Descripción

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

Puntos claves

  • Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
  • Includes coverage of environmentally friendly 'green encapsulants'
  • Presents coverage of faults and defects, and how to analyze and avoid them

De interès para

Electronics and micro-electronics industry professionals, semiconductor chip and wafer designers, anyone interested in electronic packaging

Índice

1. Introduction2. Plastic Encapsulant Materials3. Encapsulation Process Technology4. Characterization of Encapsulant Properties5. Encapsulation Defects and Failures6. Defect and Failure Analysis Techniques for Encapsulated Microelectronics7. Qualification and Quality Assurance8. Trends and Challenges

Reseñas

"Microelectronics packaging engineers will find this book to be a useful reference for various material properties. Those wanting to learn about electronics packaging could use this book to learn about packaging fundamentals and state-of-the-art in encapsulation for microelectronics."—IEEE Electrical Insulation Magazine

"This book describes encapsulants and packaging processes commonly used in the electronic industry. Electronic and microelectronic industry professionals, working in packaging areas will find this book to be a good source for up-to-date information on various process, testing, and quality assurance methods in the microelectronic packaging world."—IEEE Electrical Insulation Magazine

Detalles del producto

  • Edición: 2
  • Última edición
  • Publicado: 11 de octubre de 2018
  • Idioma: Inglés

Sobre los autores

HA

Haleh Ardebili

Dr. Haleh Ardebili has a BS honors degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience as research scientist at General Electric Global Research Center at Niskayuna, New York. She is a recipient of GE Invention Fulcrum of Progress Award. She has several years of experience teaching engineering courses at University of Houston. In Sep 2010, she joined as Assistant Professor in the Mechanical Engineering Department at University of Houston. Her research work is mainly focused on nanomaterials for Energy Storage and Electronics.
Afiliaciones y experiencia
Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University

JZ

Jiawei Zhang

Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has been honored with one Broadcom Corporation Outstanding Technical Achievement Awards for design flow. He also served on the IWLPC Technical Committee from 2013 to 2015 and as the session Chair in 2013.
Afiliaciones y experiencia
Staff Engineer, Qualcomm, San Diego, CA, USA

MP

Michael G. Pecht

He is the founder and director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow, an SAE Fellow, and an IMAPS Fellow. He is currently serving as editor-in-chief of Circuit World. He served as editor-in-chief of IEEE Access for 6 years, as editor-in-chief of IEEE Transactions on Reliability for 9 years, and as editor-in-chief of Microelectronics Reliability for 16 years. He has also served on three U.S. National Academy of Science studies, two U.S. Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is also a Chair Professor. He consults for 22 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems.
Afiliaciones y experiencia
CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA

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