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Elsevier

Libros en Ingeniería y Tecnología

  • Multi-Level Methods in Lubrication

    • 1 Edición
    • Volumen 37
    • C.H. Venner + 1 más
    • Inglés
    Efficient numerical solution of realistic and, therefore, complex equation systems occupies many researchers in many disciplines. For various reasons, but mainly in order to approximate reality, a very large number of unknowns are needed. Using classical techniques, the solution of such a system of equations would take too long, and so sometimes MultiLevel techniques are used to accelerate convergence. Over the last one and a half decades, the authors have studied the problem of Elastohydrodynamic Lubrication, governed by a complex integro-differential equation. Their work has resulted in a very efficient and stable solver. In this book they describe the different intermediate problems analyzed and solved, and how those ingredients finally come together in the EHL solver. A number of these intermediate problems, such as Hydrodynamic Lubrication and Dry Contact, are useful in their own right. In the Appendix the full codes of the Poisson problem, the Hydrodynamic Lubrication problem, the dry contact solver and the EHL solver are given. These codes are all written in 'C' language, based on the 'ANSI-C' version.

  • PC Interfacing and Data Acquisition

    Techniques for Measurement, Instrumentation and Control
    • 1 Edición
    • Kevin James
    • Inglés
    A practical guide to programming for data acquisition and measurement - must-have info in just the right amount of depth for engineers who are not programming specialists. This book offers a complete guide to the programming and interfacing techniques involved in data collection and the subsequent measurement and control systems using an IBM compatible PC. It is an essential guide for electronic engineers and technicians involved in measurement and instrumentation, DA&C programmers and students aiming to gain a working knowledge of the industrial applications of computer interfacing. A basic working knowledge of programming in a high-level language is assumed, but analytical mathematics is kept to a minimum. Sample listings are given in C and can be downloaded from the Newnes website.

  • High Voltage Engineering Fundamentals

    • 2 Edición
    • John Kuffel + 1 más
    • Inglés
    Power transfer for large systems depends on high system voltages. The basics of high voltage laboratory techniques and phenomena, together with the principles governing the design of high voltage insulation, are covered in this book for students, utility engineers, designers and operators of high voltage equipment. In this new edition the text has been entirely revised to reflect current practice. Major changes include coverage of the latest instrumentation, the use of electronegative gases such as sulfur hexafluoride, modern diagnostic techniques, and high voltage testing procedures with statistical approaches.

  • Poroelastic Structures

    • 1 Edición
    • G. Cederbaum + 2 más
    • Inglés
    Poroelasticity is a continuum theory for the analysis of a porous media consisting of an elastic matrix containing interconnected fluid-saturated pores. In physical terms the theory postulates that when a porous material is subjected to stress, the resulting matrix deformation leads to volumetric changes in the pores. This book is devoted to the analysis of fluid-saturated poroelastic beams, columns and plates made of materials for which diffusion in the longitudinal direction(s) is viable, while in the perpendicular direction(s) the flow can be considered negligible because of the micro-geometry of the solid skeletal material. Many microstructures and fabrication schemes could be imagined, which would produce bulk materials with the postulated behavior. The book provides a methodology and a theoretical basis for investigating the mechanical behaviors of the structural elements made of such materials. It is recognized that the response of the poroelastic structural element to loading is sensitive to the properties of the fluid and to the diffusion boundaries, which can be easily altered in practice. Therefore, such structural elements and thus their features are potentially controllable. In other words, it could be possible to convert such elements into intelligent or smart structures. If this is so, it would be interesting that such structural elements could work as both sensors and actuators, e.g. the fluid can "feel" the change of the temperature by changing its viscosity and this results in a change of the behavior of the structure. The present book is the first of its kind; there does not exist in the professional literature any book which deals with this subject.Chapter 1 is a general introduction and overview. The governing equations for beams are presented in Chapter 2. Chapter 3 then presents analytical solutions for the quasi-static bending problem. Series solutions are found for normal loading with various mechanical and diffusion boundary conditions. The finite element method is developed and employed for the quasi-static beams and columns with small deflections in Chapter 4. In Chapter 5 solutions are found for free and forced vibrations of poroelastic beams. Chapter 6 deals with large deflections of beams. The stability of poroelastic columns is investigated in Chapter 7. Three problems are considered: buckling, post-buckling, and dynamic stability. Formulations are found in Chapter 8 for fluid-saturated poroelastic plates consisting of a material, for which the diffusion is possible in the in-plane directions only, both for bending and for in-plane loading. This book attempts to constitute a reasonably self-contained presentation of a wide spectrum of problems related to the analysis of the type of poroelastic structure considered.

  • The Mathematics of Finite Elements and Applications X (MAFELAP 1999)

    • 1 Edición
    • J.R. Whiteman
    • Inglés
    The tenth conference on The Mathematics of Finite Elements and Applications, MAFELAP 1999, was held at Brunel University during the period 22-25 June, 1999. This book seeks to highlight certain aspects of the state-of-the-art theory and applications of finite element methods of that time.This latest conference, in the MAFELAP series, followed the well established MAFELAP pattern of bringing together mathematicians, engineers and others interested in the field to discuss finite element techniques.In the MAFELAP context finite elements have always been interpreted in a broad and inclusive manner, including techniques such as finite difference, finite volume and boundary element methods as well as actual finite element methods. Twenty-six papers were carefully selected for this book out of the 180 presentations made at the conference, and all of these reflect this style and approach to finite elements. The increasing importance of modelling, in addition to numerical discretization, error estimation and adaptivity was also studied in MAFELAP 1999.

  • Engineering Rock Mechanics

    An Introduction to the Principles
    • 1 Edición
    • John A Hudson + 1 más
    • Inglés
    Engineering rock mechanics is the discipline used to design structures built in rock. These structures encompass building foundations, dams, slopes, shafts, tunnels, caverns, hydroelectric schemes, mines, radioactive waste repositories and geothermal energy projects: in short, any structure built on or in a rock mass. Despite the variety of projects that use rock engineering, the principles remain the same. Engineering Rock Mechanics clearly and systematically explains the key principles behind rock engineering. The book covers the basic rock mechanics principles; how to study the interactions between these principles and a discussion on the fundamentals of excavation and support and the application of these in the design of surface and underground structures. Engineering Rock Mechanics is recommended as an across-the-board source of information for the benefit of anyone involved in rock mechanics and rock engineering.

  • Newnes Passive and Discrete Circuits Pocket Book

    • 2 Edición
    • R M MARSTON
    • Inglés
    Newnes Passive and Discrete Circuits Pocket Book is aimed at all engineers, technicians, students and experimenters who can build a design directly from a circuit diagram. In a highly concise form Ray Marston presents a huge compendium of circuits that can be built as they appear, adapted or used as building blocks. The devices used have been carefully chosen for their ease of availability and reasonable price. The selection of devices has been thoroughly updated for the second edition, which has also been expanded to cover the latest ICs.The three sections of the book cover: Modern passive components: relays, meters, motors, sensors and transducersDesign of attenuators, filters and bridge circuitsDiscrete semiconductor devices: JFET, MOSFET, CMOS, VMOS, UJT, SCR, TRIAC, and various optoelectronic devicesThe subjects are treated in an easy-to-read, highly practical manner with a minimum of mathematics.Ray Marston has proved, through hundreds of circuits articles and books, that he is one of the world's leading circuit designers and writers. He has written extensively for Electronics World, Nuts and Bolts, Electronics and Beyond, Popular Electronics, Electronics Now, Electronics Today International, and Electronics Australia, amongst others.

  • The Technician's EMI Handbook

    Clues and Solutions
    • 1 Edición
    • Joseph Carr
    • Inglés
    A hands-on guide to finding the sources of electromagnetic interference and then fixing the problems. Includes basic theory of EMI as well as detailed explanations of why this problem is becoming more serious as the international scope of the communications and electronics industries grow. This book is not a textbook, but rather a handbook that will become a constant source of reference for anyone who runs into trouble with EMI. Includes chapters on grounding, circuit shielding and filtering, preventing EMI in circuit design, as well as EMI sources such as power lines, transmitters, television, consumer electronics, telephones, automobiles, and the ever-frustrating mystery EMI. There are very few other books available even though EMI is constantly discussed and cursed. Most of the books on the market are about how to prevent EMI in circuit design or approaches to understanding the theory behind EMI. Though this information is important, especially to an engineering audience, these books hold no value at all to the technicians and hands-on practitioners in the fields of communications and servicing.These savvy professionals know that the book they are looking for and need is just not on the market. To get the information they need, this group is forced to read every magazine article they can find on the subject and rely on the advice of other professionals whether through technician groups or newsgroups. This book fills a void in the telecommunications and electronics industries by providing practical troubleshooting information.

  • Water Supply

    • 5 Edición
    • Alan C. Twort + 2 más
    • Inglés
    This new edition of a classic text has been significantly expanded to cover the most current issues and international standards are examined in-depth, with detailed coverage of WHO, European, UK and US standards, organisations and practice. Written with the postgraduate and professional water engineer in mind, this text will also be essential reading for undergraduates studying water engineering.

  • Advances in Imaging and Electron Physics

    • 1 Edición
    • Volumen 114
    • Peter W. Hawkes
    • Inglés
    Advances in Imaging & Electron Physics merges two long-running serials-Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

  • Three Dimensional Surface Topography

    • 1 Edición
    • Ken J Stout + 1 más
    • Inglés
    This fully illustrated text explains the basic measurement techniques, describes the commercially available instruments and provides an overview of the current perception of 3-D topography analysis in the academic world and industry, and the commonly used 3-D parameters and plots for the characterizing and visualizing 3-D surface topography. It also includes new sections providing full treatment of surface characterization, filtering technology and engineered surfaces, as well as a fully updated bibliography.

  • Processing of Wide Band Gap Semiconductors

    • 1 Edición
    • Stephen J. Pearton
    • Inglés
    Wide bandgap semiconductors, made from such materials as GaN, SiC, diamond, and ZnSe, are undergoing a strong resurgence in recent years, principally because of their direct bandgaps, which give them a huge advantage over the indirect gap Sic As an example, more than 10 million blue LEDs using this technology are sold each month, and new, high brightness (15 lumens per watt), long-life white LEDs are under development with the potential to replace incandescent bulbs in many situations. This book provides readers with a broad overview of this rapidly expanding technology, bringing them up to speed on new discoveries and commercial applications. It provides specific technical applications of key processes such as laser diodes, LEDs, and very high temperature electronic controls on engines, focusing on doping, etching, oxidation passivation, growth techniques and more.

  • Quality Management for the Technology Sector

    • 1 Edición
    • Joseph Berk + 1 más
    • Inglés
    There are many standards, methods and perhaps most confusing, but most importantly of all acronyms in use in the field of quality management, and especially so in the field of technology-based products. From the seemingly simple concepts of ISO 9000 (and the military MIL standards from which that grew) to statistical and analytical methods like Statistical Process Control (SPC) the range of complexity and compliance is staggering. What the average quality engineer or manager needs is a simple guide to what these are, how they relate to one another and most critically how to take advantage of and implement the benefits of each. This book provides that guidance.Written by a quality consultant with over 20 years experience in precisely these fields, including work with the US Defense Department, Boeing, Lockheed-Martin, Raytheon, and many other leading companies, this book provides an easily digestible toolbox of solutions to quality and management problems for every engineer, manager and even student looking for those answers for the medium to high-technology sector manufacturing company. This is a highly practical book which includes all the major topics in quality as well as case studies from relevant real-world situations yet without the need to wade through reams of reference materials and international standards verbiage. If you need to get to the bottom of problems like these, you need this book.

  • Theory and Design of Air Cushion Craft

    • 1 Edición
    • Liang Yun + 1 más
    • Inglés
    This definitive text describes the theory and design both of Air Cushion Vehicles (ACV) and Surface Effect Ships (SES). It begins by introducing hovercraft types and their development and application throughout the world in the last three decades, before going on to discuss the theoretical aspects of ACV and SES craft covering their hovering performance, dynamic trim over calm water, resistance, stability, manoeuvrability, skirt configuration and analysis of forces acting on the skirts, ACV and SES seakeeping, and the methodology of scaling aerodynamic and hydrodynamic forces acting on the ACV/SES from model test data. The latter chapters describe a design methodology, including design criteria and standard methods for estimating craft performance, lift system design, skirt design, hull structure, propulsion systems and power unit selection. Much technical information, data, and references to further work on hovercraft and SES design is provided. The book will be a useful reference to engineers, technicians, teachers, students (both undergraduate and postgraduate), operators etc. who are involved in ACV/SES research, design, construction and operation.

  • Skew-Tolerant Circuit Design

    • 1 Edición
    • David Harris
    • Inglés
    As advances in technology and circuit design boost operating frequencies of microprocessors, DSPs and other fast chips, new design challenges continue to emerge. One of the major performance limitations in today's chip designs is clock skew, the uncertainty in arrival times between a pair of clocks. Increasing clock frequencies are forcing many engineers to rethink their timing budgets and to use skew-tolerant circuit techniques for both domino and static circuits. While senior designers have long developed their own techniques for reducing the sequencing overhead of domino circuits, this knowledge has routinely been protected as trade secret and has rarely been shared. Skew-Tolerant Circuit Design presents a systematic way of achieving the same goal and puts it in the hands of all designers.This book clearly presents skew-tolerant techniques and shows how they address the challenges of clocking, latching, and clock skew. It provides the practicing circuit designer with a clearly detailed tutorial and an insightful summary of the most recent literature on these critical clock skew issues.

  • Non-Linear Static and Cyclic Analysis of Steel Frames with Semi-Rigid Connections

    • 1 Edición
    • Siu-Lai Chan + 1 más
    • Inglés
    This book is devoted to the discussion and studies of simple and efficient numerical procedures for large deflection and elasto-plastic analysis of steel frames under static and dynamic loading. In chapter 1, the basic fundamental behaviour and philosophy for design of structural steel is discussed, emphasising different modes of buckling and the inter-relationship between different types of analysis. In addition to this, different levels of refinement for non-linear analysis are described. An introduction is also given to the well-known P-&dgr; and P-&Dgr; effects. Chapter 2 presents the basic matrix method of analysis and gives several examples of linear analysis of semi-rigid pointed frames. It is evident from this that one must have a good understanding of first-order linear analysis before handling a second-order non-linear analysis. In chapter 3, the linearized bifurcation and second-order large deflection are compared and the detailed procedure for a second-order analysis based on the Newton-Raphson scheme is described. Chapter 4 introduces various solution schemes for tracing of post-buckling equilibrium paths and the Minimum Residual Displacement control method with arc-length load step control is employed for the post-buckling analysis of two and three dimensional structures. Chapter 5 addresses the non-linear behaviour and modelling of semi-rigid connections while several numerical functions for description of moment versus rotation curves of typical connection types are introduced. The scope of the work in chapter 6 covers semi-rigid connections and material yielding to the static analysis of steel frames. Chapter 7 studies the cyclic response of steel frames with semi-rigid joints and elastic material characteristics. In the last chapter the combined effects of semi-rigid connections and plastic hinges on steel frames under time-dependent loads are studied using a simple springs-in-series model. For computational effectiveness and efficiency, the concentrated plastic hinge concept is used throughout these studies.

  • Advances in Imaging and Electron Physics

    • 1 Edición
    • Volumen 112
    • Inglés
    Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

  • Advanced Array Systems, Applications and RF Technologies

    • 1 Edición
    • Nicholas Fourikis
    • Inglés
    Advanced Array Systems, Applications and RF Technologies adopts a holistic view of arrays used in radar, electronic warfare, communications, remote sensing and radioastronomy. Radio frequency (RF) and intermediate frequency (IF) signal processing is assuming a fundamental importance, owing to its increasing ability to multiply a system's capabilities in a cost-effective manner. This book comprehensively covers the important front-end RF subsystems of active phased arrays, so offering array designers new and exciting opportunities in signal processing.

  • Trends in Optical Non-Destructive Testing and Inspection

    • 1 Edición
    • P.K. Rastogi + 1 más
    • Inglés
    This book covers a wide range of measurement techniques broadly referred to as Optical Metrology, with emphasis on their applications to nondestructive testing. If we look separately at each of the two terms making the generic name Optical Metrology, we find a link to two of the most distinctive aspects of humans: a particularly well developed sense of vision and a desire to classify things using numbers and rules. Of all our five senses, vision is certainly the most developed and the closest to the rational part of our brain. It can be argued that our memory is strongly dependent on images and the brain is particularly good at processing the stimuli received from these images to extract information. Measuring, sizing and counting are, on the other hand, among the fundamental building blocks of modern society. The use of abstract quantities like size, value or intensity has simplified the description of complex enquiry and is the basis of modern science and economy. Hence, it would seem natural that the combination of two such basic aspects should result in the birth of a new field of science. However, it is known that his has not been the case. Optical Metrology remains classified as a group of special techniques used mainly in niche applications. Optical Metrology may be rightly described as an ensemble of techniques in which fields such as physics, electrical and mechanical engineering, and computer science merge and blend in new ways. This book is intended as a tribute to the career of Professor Léopold Pflug. By looking back at his lifelong commitment to the application of optical metrology to the service of engineering sciences, more particularly devoted to the observation of the real behavior of structural components, one can retrace the major revolutions that have taken place in this domain. Starting his activity in 1971 as the head of the Laboratory for Stress Analysis at the EPFL in Switzerland, he first employed photoelasticity as a tool to improve the understanding of the real behavior of complex structures. However he soon recognized the necessity of working with the real materials used to build these structures instead of on replicas made of optically birefringent materials. He then focussed on the use of moiré techniques which sparked his fascination with laser-based holography and speckle-based methods. The advent of information technology led him to open up to the use of ESPI and digital image processing techniques. Finally, in the mid 1990s he became interested in the use of optical fibers as a tool for sensing deformations inside structures, not only on their surfaces as in the case of whole-field methods. It is interesting to note the parallel in the evolution of optical metrology vis à vis developments in other fields: the development of lasers led to holographic interferometry, the availability of frame-grabbers led to ESPI and the emergence of fiber optic communications opened the way to the development of fiber optic sensors. This puts in sharp perspective the strong dependence of optical metrology on the latest technology for its development. Also interesting to note is that all fields in optical metrology touched upon by Professor Pflug are still of great relevance, as shown by the contributions in this volume. This book is, however, not intended as a commemoration, rather as an occasion to review the trends and undercurrents that are driving the field of optical metrology, with emphasis on nondestructive testing. All the authors were asked to summarize the recent achievements in their respective fields and to speculate about the future. As a result it has become apparent that it is difficult although not impossible to spot general trends in these disparate fields. Optical metrology has considerably benefited from some of the most important innovations of the recent past: lasers, computers and fiber optics communication, all of which found their direct inspiration from the developments in the world of electronics. In recent years we have also witnessed a shift of power from states to corporations. This has created the need to produce quick results useful to industry. Optical nondestructive testing has certainly adapted to this evolution, and several contributions in this book show that the researchers in this field understand the importance of developing technology that can be used by the industry to solve specific problems. We should also not forget that optical nondestructive testing is essentially a "service technology" and should as such not only focus on serving its clients in the best possible way, but also should continually emphasize, extend and enhance its services to new users still unaware of its potential. Hopefully this book will help in spreading awareness of the potentials of optical metrology and in focusing on the challenges of the future.

  • Theory of Shells

    • 1 Edición
    • Volumen 3
    • Philippe G. Ciarlet
    • Inglés
    The objective of Volume III is to lay down the proper mathematical foundations of the two-dimensional theory of shells. To this end, it provides, without any recourse to any a priori assumptions of a geometrical or mechanical nature, a mathematical justification of two-dimensional nonlinear and linear shell theories, by means of asymptotic methods, with the thickness as the "small" parameter.

  • Fatigue Design Procedure for Welded Hollow Section Joints

    Recommendations of IIW Subcommission XV-E
    • 1 Edición
    • X-L Zhao + 1 más
    • Inglés
    This International Institute of Welding (IIW) report was presented at the 52nd Annual Assembly in Lisbon in June 1999. It contains recommendations representing a consensus on international best practice, focusing on a 'hot spot stress' approach.A wide range of joint types is covered, the new fatigue design curve for both RHS and CHS is dealt with and detailed values for stress concentration factors are provided.The purpose of this current IIW document is to serve both as an International Standards Organisation (ISO) draft specification and as a model standard for national and regional specifications worldwide.The Recommendations (Part one) and Commentary (Part two) were edited by Dr X-L Zhao of Monash University, Australia and Professor J A Packer of the University of Toronto, Canada.

  • The Grouting Handbook

    A Step-by-Step Guide to Heavy Equipment Grouting
    • 1 Edición
    • Donald M. Harrison
    • Inglés
    Based on twenty years of research and field experience, this book collects a vast amount of information into a handy reference for mechanical and civil engineers. It focuses on four basic elements of grouting: load carrying capability of the foundation soil; mass design, concrete mix and installation, and curing procedures of the foundation; anchor bolts; and the grout. From the ground up, this book takes you step by step through the grouting process. Clear, straightforward directions give you details on preparing the foundation and surface, and selecting the best material and method. Comprehensive yet concise, this is a convenient handbook for veteran and rookie engineers alike.

  • CE Conformity Marking

    and New Approach Directives
    • 1 Edición
    • Ray Tricker
    • Inglés
    CE Marking can be regarded as a product's trade passport for Europe. It is a mandatory European marking for certain product groups to indicate conformity with the essential health and safety requirements set out in the European Directive. The prime aim of the CE Directive is to ensure that "all industrial products that are placed on the market do not compromise the safety and health of users when properly installed, maintained and used in accordance with their intended purpose. Users and third parties should be provided with a high level of protection and the devices should attain the performance levels claimed by the manufacturer." This book explains the meaning of CE Marking, its history, how the Directive can affect all manufacturers of industrial products, its current status, its associated quality management requirements, and how manufacturers can easily and cost-effectively meet the requirements for CE Conformance.

  • The Theory and Practice of Worm Gear Drives

    • 1 Edición
    • Ilés Dudás
    • Inglés
    Worm gears are special gears that resemble screws, and can be used to drive other gears. Worm gears, enable two non-touching shafts in a machine to mesh (join) together. This publication, unique in that it combines both theoretical and practical design aspects, including the latest results of research and development, provides detailed treatment of the theory and production of worm drives, as well as the overarching subject of production geometry of helicoidal surfaces.Included are mathematical models for a number of practical applications; a description of dressing equipment required; treatment of inspection and measurement; the use of intelligent systems; worm gearing for power transmission; selection criteria.

  • Underwater Repair Technology

    • 1 Edición
    • J Nixon
    • Inglés
    This book provides an overview of the techniques available to the offshore industry for the joining and repair of offshore structures. The last few years have seen many developments in underwater engineering technology where a wide range of welding techniques, and the necessary associated equipment, are now available for underwater joining procedures in the offshore industry.The extraction of hydrocarbons from offshore reserves is now a worldwide industry, with activity on every continent. There are huge steel and concrete structures standing in 200 metres of water, with more innovative designs, such as tethered platforms capable of operating in deeper waters, and with 1000 metre reserves currently being considered. New materials – stainless steels, duplex stainless steels, aluminium, Monel, coated materials, and non-metallic materials such as reinforced plastics are beginning to be used in significant quantities. Joining and inspection techniques have been greatly developed, and new design concepts have been brought into use.Concentrating on repair technology the author presents a survey of the techniques available for the fabrication, repair and modification of structures underwater. His book is an important reference for those working in the international offshore engineering industry, and will also be of value to universities and training establishments offering courses on marine technology.

  • Metal Machining

    Theory and Applications
    • 1 Edición
    • P.R.N. Childs
    • Inglés
    Metal machining is the most widespread metal-shaping process in the mechanical manufacturing industry. World-wide investment in metal machining tools increases year on year - and the wealth of nations can be judged by it. This text - the most up-to-date in the field - provides in-depth discussion of the theory and application of metal machining at an advanced level. It begins with an overview of the development of metal machining and its role in the current industrial environment and continues with a discussion of the theory and practice of machining. The underlying mechanics are analysed in detail and there are extensive chapters examining applications through a discussion of simulation and process control."Metal Machining: Theory and Applications" is essential reading for senior undergraduates and postgraduates specialising in cutting technology. It is also an invaluable reference tool for professional engineers. Professors Childs, Maekawa, Obikawa and Yamane are four of the leading authorities on metal machining and have worked together for many years.

  • Advances in Imaging and Electron Physics

    • 1 Edición
    • Volumen 113
    • Peter W. Hawkes
    • Inglés
    Advances in Imaging & Electron Physics merges two long-running serials--Advances in Electronics & Electron Physics and Advances in Optical & Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

  • Microcontroller Projects in C for the 8051

    • 1 Edición
    • Dogan Ibrahim
    • Inglés
    This book is a thoroughly practical way to explore the 8051 and discover C programming through project work. Through graded projects, Dogan Ibrahim introduces the reader to the fundamentals of microelectronics, the 8051 family, programming in C, and the use of a C compiler. The specific device used for examples is the AT89C2051 - a small, economical chip with re-writable memory, readily available from the major component suppliers. A working knowledge of microcontrollers, and how to program them, is essential for all students of electronics. In this rapidly expanding field many students and professionals at all levels need to get up to speed with practical microcontroller applications. Their rapid fall in price has made microcontrollers the most exciting and accessible new development in electronics for years - rendering them equally popular with engineers, electronics hobbyists and teachers looking for a fresh range of projects. Microcontroller Projects in C for the 8051 is an ideal resource for self-study as well as providing an interesting, enjoyable and easily mastered alternative to more theoretical textbooks.

  • Valve Radio and Audio Repair Handbook

    • 1 Edición
    • CHAS MILLER
    • Inglés
    Valve Radio and Audio Repair Handbook is not only an essential read for every professional working with antique radio and gramophone equipment, but also dealers, collectors and valve technology enthusiasts the world over. The emphasis is firmly on the practicalities of repairing and restoring, so technical content is kept to a minimum, and always explained in a way that can be followed by readers with no background in electronics. Those who have a good grounding in electronics, but wish to learn more about the practical aspects, will benefit from the emphasis given to hands-on repair work, covering mechanical as well as electrical aspects of servicing. Repair techniques are also illustrated throughout. This book is an expanded and updated version of Chas Miller's classic Practical Handbook of Valve Radio Repair. Full coverage of valve amplifiers will add to its appeal to all audio enthusiasts who appreciate the sound quality of valve equipment.

  • Newnes Workshop Engineer's Pocket Book

    • 1 Edición
    • Roger Timings
    • Inglés
    This Pocket Book is a unique compilation of all the tables, data, techniques, formulae and rules of thumb needed by mechanical engineers in the workshop, at work or at home. With content covering areas such as: workshop calculations and conversion tables; cutting tools; engineering materials; soldering fluxes, and O-rings, it will prove to be an essential tool for technicians, students, model engineers and DIY enthusiasts alike. British Standards are used and referenced throughout.Roger Timings has drawn on his unique practical experience as an engineer, lecturer, author and model engineer to select and bring together the information needed for practical workshop-based engineering. Most of the material in this book has been drawn from his definitive reference work Newnes Mechanical Engineer's Pocket Book, but it has been redrawn and redesigned for ease of reference in the workshop.With Newnes Workshop Engineer's Pocket Book, those undertaking workshop-based engineering projects now have all the key facts, figures, data and tables they need, together in one handy reference guide.

  • Hot Embossing

    Theory and Technology of Microreplication
    • 1 Edición
    • Matthias Worgull
    • Inglés
    This book is an overview of replication technology for micro- and nanostructures, focusing on the techniques and technology of hot embossing, a scaleable and multi-purpose technology for the manufacture of devices such as BioMEMS and microfluidic devices which are expected to revolutionize a wide range of medical and industrial processes over the coming decade.The hot embossing process for replicating microstructures was developed by the Forschungszentrum Karlsruhe (Karlsruhe Institute of Technology) where the author is head of the Nanoreplication Group. Worgull fills a gap in existing information by fully detailing the technology and techniques of hot embossing. He also covers nanoimprinting, a process related to hot embossing, with examples of actual research topics and new applications in nanoreplication.

  • Principles of Modern Grinding Technology

    • 1 Edición
    • W. Brian Rowe
    • Inglés
    The book is aimed at practitioners, engineers, researchers, students and teachers. The approach is direct, concise and authoritative. Progressing through each major element of the grinding system and then on to machine developments and process control, the reader becomes aware of all aspects of operation and design. Trends are described demonstrating key features. Coverage includes abrasives and super-abrasives, wheel design, dressing technology, machine accuracy and productivity, grinding machine design, high-speed grinding technology, cost optimization, ultra-precision grinding, process control developments, vibration control, coolants and fluid delivery.

  • Multilayer Flexible Packaging

    Technology and Applications for the Food, Personal Care, and Over-the-Counter Pharmaceutical Industries
    • 1 Edición
    • John R. Wagner Jr.
    • John R. Wagner Jr.
    • Inglés
    A comprehensive and highly practical survey of the materials, hardware, processes and applications of flexible plastic films. Aimed at a wide audience of engineers, technicians, managers, purchasing agents and users, Multilayer Flexible Packaging provides a thorough introduction to the manufacturing and applications of flexible plastic films, covering: Materials Hardware and Processes Multilayer film designs and applications The materials coverage includes detailed sections on polyethylene, polypropylene and additives. The dies used to produce multilayer films are explored in the hardware section, and the process engineering of film manufacture explained, with a particular focus on meeting specifications and targets. The section includes unique coverage of the problematic area of bending technology, providing a unique explanation of the issues involved in the blending of viscoelastic non-Newtonian polymeric materials. About the author John R. Wagner, Jr. is President of Crescent Associates, Inc., a consulting firm that specializes in plastic films and flexible packaging. He graduated from the University of Notre Dame with a BS and MS in Chemical Engineering.

  • Micromachining Using Electrochemical Discharge Phenomenon

    Fundamentals and Application of Spark Assisted Chemical Engraving
    • 1 Edición
    • Rolf Wuthrich + 1 más
    • Inglés
    This book explains the fundamentals of SACE, promotes the technology, and encourages researchers and engineers from industry to use it for their specific applications. Therefore, the book, after presenting in details the fundaments of SACE (in particular the Electrochemical Discharges), deals mainly with practical aspects of implementing the machining technology. The book is written so that researchers from fields other than micro-technology (e.g., from life science) will be able to build a simple machining set-up, together with his mechanical work-shop, for individual needs.

  • Microfabrication for Industrial Applications

    • 1 Edición
    • Regina Luttge
    • Inglés
    Microfabrication for Industrial Applications focuses on the industrial perspective for micro- and nanofabrication methods including large-scale manufacturing, transfer of concepts from lab to factory, process tolerance, yield, robustness, and cost. It gives a history of miniaturization, micro- and nanofabrication, and surveys industrial fields of application, illustrating fabrication processes of relevant micro and nano devices.Concerning sub-micron feature manufacture, the book explains: the philosophy of micro/ nanofabrication for integrated circuit industry; thin film deposition; (waveguide, plastic, semiconductor) material processing; packaging; interconnects; stress (e.g., thin film residual); economic; and environmental aspects.Micro/nanome... sensors and actuators are explained in depth with information on applications, materials (incl. functional polymers), methods, testing, fabrication, integration, reliability, magnetic microstructures, etc.

  • Plastics in Medical Devices

    Properties, Requirements and Applications
    • 1 Edición
    • Vinny R. Sastri
    • Inglés
    No book has been published that gives a detailed description of all the types of plastic materials used in medical devices, the unique requirements that the materials need to comply with and the ways standard plastics can be modified to meet such needs. This book will start with an introduction to medical devices, their classification and some of the regulations (both US and global) that affect their design, production and sale. A couple of chapters will focus on all the requirements that plastics need to meet for medical device applications. The subsequent chapters describe the various types of plastic materials, their properties profiles, the advantages and disadvantages for medical device applications, the techniques by which their properties can be enhanced, and real-world examples of their use. Comparative tables will allow readers to find the right classes of materials suitable for their applications or new product development needs.

  • The Effect of Creep and Other Time Related Factors on Plastics and Elastomers

    • 2 Edición
    • Laurence W. McKeen
    • Inglés
    The second edition of the classic data book, The Effect of Creep and Other Time Related Factors on Plastics and Elastomers (originally published in 1991), has been extensively revised with the addition of an abundance of new data, the removal of all out-dated information, and the complete rebuilding of the product and company listings.This new edition also has been reorganized from a polymer chemistry point of view. Plastics of similar polymer types are grouped into chapters, each with an introduction that briefly explains the chemistry of the polymers used in the plastics. An extensive introductory chapter has also been added, which summarizes the chemistry of making polymers, the formulation of plastics, creep-testing, test methods, measurements, and charts, as well as theory and plastic selection.Each chapter is generally organized by product and concludes with comparisons of brand or generic products. The appendices include a list of trade names, plastics sold under those names, and manufacturer. A list of conversion factors for stress measures is also included.ABOUT THE AUTHORLaurence W. McKeen earned a B.S. in Chemistry from Rensselaer Polytechnic Institute in 1973 and a Ph.D. in 1978 from the University of Wisconsin. He began his career with DuPont in 1978 as a mass spectroscopist, but moved into product development in the Teflon® Finishes group in 1980. Dr. McKeen has accumulated over 28 years of experience in product development and applications, working with customers in a wide range of industries, which has led to the creation of dozens of commercial products.

  • Micromanufacturing Engineering and Technology

    • 1 Edición
    • Yi Qin
    • Yi Qin
    • Inglés
    Micromanufacturing Engineering and Technology presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential. The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging.

  • Microwave/RF Applicators and Probes for Material Heating, Sensing, and Plasma Generation

    A Design Guide
    • 1 Edición
    • Mehrdad Mehdizadeh
    • Inglés
    Interactions of electromagnetic fields with materials at high frequencies have given rise to a vast array of practical applications in industry, science, medicine, and consumer markets. Applicators or probes, which are the front end of these systems, provide the field that interacts with the material. This book takes an integrated approach to the area of high frequency applicators and probes for material interactions, providing a toolkit for those who design these devices. Particular attention is given to real-world applications and the latest developments in the area. Mathematical methods are provided as design tools, and are often simplified via curve-fitting techniques that are particularly usable by handheld calculators. Useful equations and numerically solved examples, using situations encountered in practice, are supplied. Above all, this volume is a comprehensive and useful reference where the reader can find design rules and principles of high frequency applicators and probes for material processing and sensing applications. Electronic and electrical R&D engineers, physicists, university professors and students will all find this book a valuable reference. Mehrdad Mehdizadeh is with the DuPont Company, Engineering Research & Technology Division in Wilmington, Delaware. His areas of expertise include high frequency hardware and electromagnetic methods of processing, sensing, and characterization of materials. His work and innovation in industrial, scientific, and medical applications of radio frequency and microwaves has resulted in 19 US patents and a number of publications. He earned his Ph.D. and M.S. from Marquette University (1983, 1980), and a B.S. from Sharif University of Technology (1977), all in electrical engineering. Dr. Mehdizadeh is a Senior Member of the Institute of Electrical and Electronic Engineers (IEEE ), Sigma Xi (Scientific Research Society), the International Microwave Power Institute (IMPI ), and a voting member of IEEE Standard Association.

  • Nanotechnology Environmental Health and Safety

    Risks, Regulation and Management
    • 1 Edición
    • Matthew Scott Hull + 1 más
    • Matthew Scott Hull + 1 más
    • Inglés
    This book tackles the debate over nanotechnology's environmental health and safety (EHS) by thoroughly explaining EHS issues, financial implications, foreseeable risks (i.e. exposure, dose, hazards of nanomaterials), and the implications of occupational hygiene precautions and consumer protections. Real-world case studies are included, e.g. the discussion of a leading chemical company's unusual pairing with the USA's largest environmental NGO, and an innovative program designed for small- to mid-sized businesses, which became a model approach for proactive nanotechnology EHS risk management.

  • Handbook of Silicon Based MEMS Materials and Technologies

    • 1 Edición
    • Markku Tilli + 6 más
    • Inglés
    A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

  • Handbook of Deposition Technologies for Films and Coatings

    Science, Applications and Technology
    • 3 Edición
    • Peter M. Martin
    • Inglés
    This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.

  • Encapsulation Technologies for Electronic Applications

    • 1 Edición
    • Haleh Ardebili + 1 más
    • Inglés
    Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-s... (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packagin... (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechan... systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.

  • Sputtering Materials for VLSI and Thin Film Devices

    • 1 Edición
    • Jaydeep Sarkar
    • Inglés
    An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. .

  • Rotational Molding Technology

    • 1 Edición
    • R.J. Crawford + 1 más
    • Inglés
    This book clarifies and quantifies many of the technical interactions in the process. It distinguishes itself from other books on the subject by being a seamless story of the advanced aspects of the rotational molding process. There are seven chapters within the book. The US market for rotational molding products was one billion pounds in the year 2000. The growth of the rotational molding industry has grown at 10 to 15% per year. With this growth has come an increasing need for details on the complex, technical aspects of the process.

  • Handbook of Physical Vapor Deposition (PVD) Processing

    • 2 Edición
    • Donald M. Mattox
    • Inglés
    This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called "war stories", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.

  • Non-Destructive Testing in Civil Engineering 2000

    • 1 Edición
    • T. Uomoto
    • Inglés
    The first international symposium on NDT-CE (Non-Destructive Testing in Civil Engineering) was held in Berlin, Germany in 1991. Successive symposia were held throughout Europe until 1997. This, the 5th symposium is organized as SEIKEN SYMPOSIUM No. 26, and is sponsored by the Institute of Industrial Science, at the University of Tokyo, Japan. Original objectives of the NDT-CE symposium have been to provide an opportunity for discussing current issues and future perspectives of NDT and for promoting mutual understanding among engineers and researchers. Asia is one of the key regions for further development in NDT and this symposium in Japan will be a good opportunity not only to exchange technical information on NDT, but to promote worldwide friendship between engineers in Asian countries and other nations of the world. This volume contains 70 papers providing the most recent research results and findings. The papers are grouped under the following areas: (1) keynote papers, (2) magnetic / electric, (3) steel structures, (4) integrated test, (5) moisture, (6) strength, (7) acoustic emission, (8) various tests, (9) ultrasonic, (10) impact echo, (11) radar, (12) quality and (13) corrosion / cover.

  • Bioimpedance and Bioelectricity Basics

    • 1 Edición
    • Sverre Grimnes + 1 más
    • Inglés
    Bioimpedance and Bioelectricity Basics is unique in providing all the information needed to follow the interdisciplinary subjects of bioimpedance and bioelectricity without having to be a graduate student in the relevant fields. For the first time, one book offers the broadest possible introduction to all use and effects of electrical fields in tissue, dealing with the most basic chemical and physical functions of life. Very few books have covered the dielectric and electrochemical side of the subject, despite its importance; Bioimpedance and Bioelectricity Basics does. It also includes the electrical engineering concepts of network theory and the complex math needed. Up to now, there has been work done by physicists and engineers on one side, doctors and biologists on the other, this book fills the gap, providing the knowledge for both groups.

  • Pocket Guide to Preventing Process Plant Materials Mix-ups

    • 1 Edición
    • Bert Moniz
    • Inglés
    This handy pocket guide condenses vital information into a simple format that explains how to prevent costly materials mix-ups that result from a deficiency in the supply chain. Using easy-to-read, straightforward language, it outlines effective methods of specifying, procuring, receiving and verifying critical materials. Pocket Guide to Preventing Process Plant Materials Mix-ups illustrates how to test and identify materials and provides what you need to know to choose between the various production methods.

  • Battery Reference Book

    • 3 Edición
    • Thomas P J Crompton
    • Inglés
    Crompton's Battery Reference Book has become the standard reference source for a wide range of professionals and students involved in designing, manufacturing, and specifying products and systems that use batteries. This book is unique in providing extensive data on specific battery types, manufacturers and suppliers, as well as covering the theory - an aspect of the book which makes an updated edition important for every professional's library. The coverage of different types of battery is fully comprehensive, ranging from minute button cells to large installations weighing several hundred tonnes.

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